Macromelt Low Pressure Molding Solutions

Macromelt

Henkel's renowned Macromelt® low-pressure molding solution is delivering superior sealing adhesion and excellent temperature and solvent resistance.

The simplicity of these materials is their advantage: because the entire Macromelt® operation takes place at low pressure, cycle time is short and fine or fragile circuitry is not damaged, delivering measurable improvements over that of traditional potting or encapsulating processes. PCB and circuitry protection is essential in modern, challenging applications; and Henkel delivers manufacturers proven, reliable solutions and peace-of-mind.


Polyamide Polyolefin
Polyamide Polyolefin