Semiconductor Assembly

Meeting the demands of consumers and packaging specialists
Today’s consumers want smaller devices, more functionality, outstanding reliability and, of course, lower cost. When it comes to semiconductor packaging, it’s possible to have it all with materials solutions from Henkel. As a pioneer in the semiconductor packaging market, Henkel has successfully enabled many of today’s leading consumer products.  

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Serving a variety of markets and facilitating production of advanced devices, Henkel has a complete portfolio of die attach, underfill, encapsulant, mold compound and solder sphere products for nearly any package and any application, including:

  • Logic/ASICs
  • Flash/DRAM
  • Photonics
  • Discrete/Passives

For sophisticated stacked die applications, Ablestik die attach materials are the brand packaging professionals trust. With a proven track record of performance, reliability and processability, Ablestik die attach pastes, films, self-filleting and wafer backside coating materials enable today’s ultra-thin die stacking processes effectively and cost-efficiently.

When it comes to wafer-level underfill and encapsulant technology, Henkel’s Hysol brand materials are world-class. Hysol package-level underfill systems are facilitating advances in flip-chip technology, enabling outstanding protection for these delicate devices. All our package-level underfills meet JEDEC testing requirements and the demands of lead-free processing. Further protection is provided with Hysol semiconductor encapsulants, which work together as dam-and-fill materials for bare chip encapsulation. Our high-purity liquid epoxy encapsulants offer protection from mechanical damage and corrosion during the assembly process.

The demands of lead-free processing pose new challenges to the semiconductor industry, as the alloys used for board-level processes are not the most robust for semiconductor applications. 
Hysol molding compounds provide the ultimate in component protection and operator ease-of-use.  Designed for use with both auto molds and conventional molds, Henkel’s Hysol molding compounds combine low stress and low moisture absorption with high physical strength. What’s more, Henkel’s unique low warpage formulation affords superior protection without the adverse effects of die warpage that often occurs during the molding process.

Camera Modules & Image Sensors
Image sensors are devices that are integrated into digital cameras, cell phones and other handheld devices where functionality dictates image capture capability. Image processors such as digital light processors (DLPs) are incorporated into projectors, televisions and,now, even into cell phones.

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DRAM
The quality of a memory module is directly related to its DRAM (Dynamic Random Access Memory) chips. Henkel recognizes the importance of this essential memory system in computers and workstations, and provides an array of products that improve the consistency and reliability of the DRAM assembly process.

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Memory
Flash memory forms the data storage of mobile phones, core of MP3 players and most semiconductor memory card formats available today. Demand for these non-volatile memory devices has grown rapidly due to the expansion of mobile handsets, MP3 players and memory cards.

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Optoelectronics
Henkel’s Ablestik and Hysol brands offer the world’s most complete line of adhesives for fiber optic and optoelectronic applications. Companies around the world trust Ablestik for semiconductor packaging and assembly products, including UV/Visible light cure and thermal cure adhesives.

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Passives Components
Henkel has been supplying into the passives and discretes market for more than 25 years and has established a reputation for quality, performance and value for money. In fact, Henkel today is the number one supplier of materials to the passives and discretes industry.

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Smart Card
Henkel’s state of the art adhesives cover a multiplicity of applications in the Smartcard industry and make a contribution in this fast growing and future oriented business.

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Wirebond Packaging
Wire bonding is the technology most widely used to create the interconnect for today’s semiconductor devices.

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