Semiconductor Assembly

Meeting the demands of consumers and packaging specialists
Today’s consumers want smaller devices, more functionality, outstanding reliability and, of course, lower cost. When it comes to semiconductor packaging, it’s possible to have it all with materials solutions from Henkel. As a pioneer in the semiconductor packaging market, Henkel has successfully enabled many of today’s leading consumer products.  

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Serving a variety of markets and facilitating production of advanced devices, Henkel has a complete portfolio of die attach, underfill, encapsulant, mold compound and solder sphere products for nearly any package and any application, including:

  • Logic/ASICs
  • Flash/DRAM
  • Photonics
  • Discrete/Passives

For sophisticated stacked die applications, Ablestik die attach materials are the brand packaging professionals trust. With a proven track record of performance, reliability and processability, Ablestik die attach pastes, films, self-filleting and wafer backside coating materials enable today’s ultra-thin die stacking processes effectively and cost-efficiently.

When it comes to wafer-level underfill and encapsulant technology, Henkel’s Hysol brand materials are world-class. Hysol package-level underfill systems are facilitating advances in flip-chip technology, enabling outstanding protection for these delicate devices. All our package-level underfills meet JEDEC testing requirements and the demands of lead-free processing. Further protection is provided with Hysol semiconductor encapsulants, which work together as dam-and-fill materials for bare chip encapsulation. Our high-purity liquid epoxy encapsulants offer protection from mechanical damage and corrosion during the assembly process.

The demands of lead-free processing pose new challenges to the semiconductor industry, as the alloys used for board-level processes are not the most robust for semiconductor applications. 
Hysol molding compounds provide the ultimate in component protection and operator ease-of-use.  Designed for use with both auto molds and conventional molds, Henkel’s Hysol molding compounds combine low stress and low moisture absorption with high physical strength. What’s more, Henkel’s unique low warpage formulation affords superior protection without the adverse effects of die warpage that often occurs during the molding process.

Camera Modules & Image Sensors
Image sensors that are integrated with control electronics that transfer optical signal into a digital signal are found in numerous applications, including handheld devices, audio, TV and gaming products, traditional DSC and SLR cameras, video camcorders, automobiles and medical systems, with handhelds driving the largest percentage of the growth. Incorporation of image sensors and all their complementary parts requires adhesive materials that cure quickly at low temperature, deliver precise position and bondline control and, in many cases, UV and transparency properties. Through the use of rheology control and filler technology, Henkel has designed unique adhesives to address emerging requirements of image sensor assembly.  

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DRAM
The quality of a memory module is directly related to its DRAM (Dynamic Random Access Memory) chips. Henkel recognizes the importance of this essential memory system in computers and workstations, and provides an array of products that improve the consistency and reliability of the DRAM assembly process.

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IC Laminate

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IC Leadframe

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Logic
Henkel has been supplying into the Logic / ASIC semiconductor market for decades and has established a reputation for quality, performance and value for money. In fact, Henkel today is the one of the most trusted suppliers to the semiconductor industry.

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Memory
Flash memory forms the data storage of mobile phones, core of MP3 players and most semiconductor memory card formats available today. Demand for these non-volatile memory devices has grown rapidly due to the expansion of mobile handsets, MP3 players and memory cards.

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Optoelectronics
Optoelectronic applications enable all types of data transfer, allowing us to lead lives that are more convenient and information rich. The most effective, efficient and advanced method of data transmission, optoelectronics leverage fiber-optic cables and multiple-optic components to deliver large quantities of information quickly over long distances.  
The integrity of the transmission is highly dependent upon the reliability of the fiber-optic connections and the assembly of the accompanying components, such as repeaters, amplifiers and splitters. To ensure robust performance and long-term reliability, advanced capability optoelectronic materials are essential. Henkel’s broad range of LOCTITE®-brand adhesives allows optoelectronic specialists to choose the material that suits specific manufacturing requirements. With superb reliability, fast-cure capability via UV, visible light or thermal techniques, and excellent adhesion on a variety of opto-surfaces, Henkel’s suite of optoelectronic adhesives exceeds today’s market needs.

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Passives Components
As the name implies, passive components do not alter the incoming electrical signal. These packages do, however, play important roles, such as filtering and power supply regulation, and are found on almost all printed circuit board assemblies. Producing these functional devices with materials that enable cost-efficiency and reduced footprints is critical to ensuring competitiveness. Henkel’s full suite of molding compounds, solder and conductive and non-conductive adhesive materials help reduce cost of ownership and address miniaturization challenges for the production of cost-competitive passives. 

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Smart Card
For secure and data-sensitive transactions, smart cards are the product of choice. Different from RFID in the mechanism for communicating the transaction data and registering the security safeguards, smart cards leverage the power of an embedded chip for data management. Application use for smart cards is growing with the most common sectors being SIM cards, banking cards, government and identification cards and transportation. These devices require materials that are highly reliable, cost-competitive and cure quickly for fast throughput rates. Henkel’s portfolio of high performance, low resin, bleed die attach pastes and fast, UV-curable encapsulants deliver on today’s demanding smart card manufacturing requirements. In addition, Henkel’s broad worldwide resources enable access to local service and manufacturing capabilities to support global business operations and multi-regional deployment.

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Wirebond Packaging
Any integrated circuit that achieves die connectivity through the use of thin wires is known as a wirebond package. BGAs, QFNs, QFPs and SOICs all fall into this category and are found in computers, tablets, smartphones and automobiles. Driving the advancement of wirebond packaging is the need to put more functionality into increasingly smaller geometries, which requires a reduction of the die-to-substrate ratio and the ability to manage very thin dies to reduce package height. Within the automotive sector, where semiconductor use is increasing as vehicles incorporate more electronics, RoHS compliance and high-reliability requirements demand material innovation. Regardless of the wirebond-device application, Henkel’s die attach, solder, mold compound and thermal management materials are enabling packaging specialists to address current and future manufacturing requirements. 

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The European association for the self-adhesive label industry