NCP for Thermal Compression Bonding
Much like our Underfill products, these NCP technology products also offer superior moisture and thermal cycling resistance while still meeting JEDEC testing standards. Flip-chip assembly is simplified by enabling an alternative to traditional Controlled Collapse Chip Connection (C4) soldering, that bonds bumps to the substrate through an innovative Pb-free compatible thermal compression process.
Possibly the most impressive quality now offered by Hysol NCPs is the new process known as Accelerated Cooling (AC). This new process improved the effectiveness of the NCPs and, unlike conventional thermal compression processes, Henkel’s AC process heats the device while the flip-chip bonder head secures it. It is then rapidly cooled during compression onto the NCP-coated substrate, which enables assembly completion prior to any excess heat exposure. The result? A significant reduction in package warp, voids caused by moisture and assembly cycle time.
|Laminate Packages CSP, SCSP, SIP||Flip-Chip on Flex Circuits (FCOF)||RFID, Misc, Assembly|