These range from micro-miniature surface mount Tantalum (Ta) capacitors up through power resistors and complete resistor networks. In each area, encapsulants such as liquid Potting and powder Molding Compounds are used. In addition, Silver (Ag) and graphite-based materials are widely used for termination and both internal and external connections.
|Conductive Pastes||Conductive Coatings||Graphite Coatings|
|Electric Molding Compounds|