Events Archive

EIS supplies a full range of critical products to three primary market segments in North America – the electrical original equipment manufacturer, the electronic assembler, and the motor apparatus repair industry. Our products range from insulating and conductive materials to assembly tools, test equipment, safety and shop supplies, industrial products and customized parts. At our Expo you will find both exhibitors and attendees eager to create new bonds and provide new solutions for your industry.

All kinds of products, technologies and services; equipment, device and material, that can contribute to miniaturization and thinning of cutting edge devices such as Semiconductors, LED, Power Devices, Sensors and MEMS will gather. ICP is an essential business venue for the specialists from a variety of fields to seek the packaging technology.

MD&M West conference will once again cover industry's most timely and critical issues for R&D, product development, design, engineering, quality, manufacturing, and regulatory affairs professionals within the medical device industry. Attendees can expect to come with their most pressing questions and leave with the information they need to improve their products, process, and business.

Up to date, SNEC (2011) PV POWER EXPO has got over 1,300 exhibitors including world famous brand companies in the PV industry from over 60 countries and regions, such as Germany, America, Japan, France, etc. The total exhibition space has reached 120,000 sq. meters and is expected to reach 150,000 sq. meters. 4,000 experts and scholars, 100,000 professionals, including buyers, suppliers, integrators, etc., will gather in Shanghai for this grand occasion.

Semiconductor industry has been identified by the Chinese government as a strategic investment area. With strong market recovery in first and second quarter, Chinese companies have started building new fabs to fuel the solid growth of chipmaking in China. As Hua Li, and SMIC are demonstrating, chip companies from other regions will follow.

SEMI-THERM is an international forum dedicated to the thermal design and characterization of electronic components and systems. The symposium fosters the exchange of knowledge between practitioners and leading experts from industry, as well as the exchange of information on the latest academic and industrial advances in electronics thermal management. We encourage you to report on your latest modeling, designs, and results.

There are many ways and sources to look for products and suppliers, but only the business fairs allow buyers to understand the intended benefits of a product or of a service rendering. See for yourself, ask the inventors and compare the performances. Examine, question and compare the products. Exhibitions are  recognized a  great place to release products; therefore, this is an efficient way to keep updated within a short period of time.

At Nepcon East & Electronics Expo find the tools you need to accelerate your electronics project to market. Electronics suppliers are eager to meet with you face-to-face and offer the best solutions for your industry. Networking opportunities also abound, and will provide you with the chance to explore potential alliances, partnerships and joint ventures. Not to mention the free educational sessions, this Expo simply cannot be missed.

The IPC APEX Expo is the premier electronics industry conference and exhibition where thousands of colleagues from more than 50 countries come together. Find new suppliers, new solutions, visit more than 300 exhibitors, and view keynote speakers that appeal to you and your business.

FINETECH JAPAN is the world's largest FPD trade show. All kinds of manufacturing equipment, components, materials, inspection devices, and displays gather at one time, and plenty of visitors from worldwide panel manufacturers attend the show every year.

SMT/HYBRID/PACKAGING is Europe´s  leading event on System Integration in  Micro Electronics. Meet the industry's leading companies for SMT-Equipment, Components and SMT-Services from 3 - 5 May 2011 in Nuremberg, Germany. With 29% foreign exhibitors, the event offers not only a  wide, but also an international spectrum.

NEPCON China is one of the biggest and longest standing trading and sourcing platforms for the Chinese SMT industry. This widely respected exhibition is a vibrant showcase for all brands from across the SMT world. It is also where the leaders in brand building, lead generation and networking for global SMT equipment and products suppliers gather.

The market for sensors and related technologies is expanding at a phenomenal rate. Save months of time researching your best options by spending three information-packed days at Sensors Expo, examining solutions for your toughest sensing challenges.

This year's Lighting show and exhibition will be held in Guangzhou, China. The biggest lighting fair in Asia, this year's show promises to be an impressive gathering of over 2,600 exhibitors and at least 100,000 visitors!

SEMICON West attracts buyers and engineers from every one of the world's top device makers, foundries, outsourced test/packaging houses, and OEMs.

NEPCON South China is one of the biggest and longest standing trading and sourcing platform for the electronics manufacturing industry in South China, one of the important production hubs that contributed a third of China’s total export.

The European Photovoltaic Solar Energy Conference and Exhibition (EU PVSEC) - the worlds largest specialised PV Solar Energy Conference - serves as an ideal platform for the collection, exchange and dissemination of scientific know-how and is furthermore renowned for the high standard of its scientific contributions.

Besides regular exhibits, 8 technology pavilions and more country pavilions will drive traffic and bring energy to the show floor of SEMICON Taiwan 2011. It's sure to be an amazing turn out.

The conference will give the opportunity to learn more about most important microelectronics applications developments which enable novel, advanced packaging Solutions to be the key drivers in system integration of electronic devices.

Learn how to dramatically reduce costs, provide a simple one-step molding alternative and deliver measurable improvements in manufacturing efficiency.

The world’s leading trade fair for all aspects of innovative electronics production – with an almost 100% share of high-profile trade visitors.

Medical Design & Manufacturing (MD&M) West is the most comprehensive resource for every aspect of medical device development. It gathers medtech professionals and leading medical OEM suppliers together to provide you with immediate hands-on access to the tools you need to accelerate your new device to market, all in one convenient location.

Join thousands of colleagues from more than 50 countries at our industry's premier event — featuring advanced and emerging technologies in printed board design and manufacturing, electronics assembly and test. In 2012, be part of the new focus on printed electronics! Find new suppliers with new solutions and connect with colleagues from around the world.

Location: Henkel Technologies, Tallaght, Dublin, Ireland

This workshop is jointly organized by Henkel and by SMART Group. Technology, economics, new materials and processes are key factors in selection for future product designs. Often there are competing requirements during the selection process. This event is a unique opportunity to hear the latest advances in production processes in manufacture. Delegates will be able to compare materials & processes to see if they meet their future needs. Speakers include Jan Wijgaerts & Cindy Doumen from Henkel and Bob Willis from SMART Group.

SEMICON China trade events are unique sales environments that attract the most influential and important buyers in China’s semiconductor industry.

The 4th i-tronik workshop is supported by Henkel Electronics and will be held in Padua, Italy. At this event, Electronics Manufacturers meet end-users to dicuss latest technologies.

FINETECH JAPAN is the World's Largest FPD Tradeshow, annually held in Tokyo in April. Including 4 different FPD-related special fairs, FINETECH JAPAN showcases the latest displays, touch panels ,components, materials, and manufacturing and inspection devices at one time and plenty of all industry professionals from worldwide panel manufacturers gather at the show.

Location: Henkel, Hemel Hempstead, Hertfordshire, UK

This workshop is jointly organized by Henkel and SMART Group. It will look at the benefits and disadvantages of ENIG, OSP, Immersion Silver, tin and solder leveling as current options for printed circuit board solderable finishes. The session will also review the performance during PCB fabrication and assembly plus some of the common process problems experienced in industry. The Workshop will conclude with a practical session where delegates will be able to see firsthand the use of such finishes in manufacture.

This year's show will be held in Nuremberg, Germany. Henkel will attend the PCIM conference and present a joint paper with Hala and Infineon.

This year's show will be held in Nuremberg, Germany. From Henkel’s stand, #353 in Hall 9, our team will be available to discuss our broad range of electronics materials solutions and latest innovations.

With many new manufacturing technologies coming to market (including vertical transistors, 3D IC, advanced materials, 450mm, and EUV) and with the continued growth of emerging and adjacent microelectronics markets (including high-brightness LEDs, MEMS, power semiconductors, and flexible electronics), 2012 is already shaping up to be an important year for the global microelectronics supply chain.

The Strategic Electronics sector presents an unprecedented opportunity as well as a challenge. All modern warfare systems, including fly by wire, avionics, telecommunications, sonar systems, navigation and surveillance depend heavily on electronic systems.

The 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP 2012) will be held in Guilin, China, from August 13 to 16, 2012. The ICEPT-HDP 2012 is organized by Electronic Manufacturing and Packaging Technology Society (EMPT) of Chinese Institute of Electronics (CIE) and co-organized by Guilin University of Electronic Technology.

SEMICON Taiwan is the premier event in Taiwan for microelectronics manufacturing. Connect with the companies, people, products and information shaping the future of design and manufacturing for semiconductors, nanoelectronics, MEMS, Photovoltaics and related advanced electronics. Experience everything that SEMICON Taiwan has to offer - Don't miss it!

Join us in Huntsville Alabama for a free one-day Cleaning and Reliability workshop. Five industry experts from Aqueous Technologies, Henkel, Kyzen, PVA, and STI Electronics join forces to present valuable solutions to today's most challenging cleaning and reliability issues.

Conference and Exhibition Centre of Amsterdam, The Netherlands. The Electronics System Integration Technology Conferences (ESTC) conference series is the premier global European event that brings together key researchers, technologists, businesses, and professional associations working in interconnect and packaging technologies for electronic system integration. Henkel will present on New Conductive Adhesives Technologies in Circuit Assembly and Semiconductor Packaging.

Spread Eagle Hotel, Cornmarket, Thame, Oxfordshire, England, UK. This conference is intended for all who are interested in O% rework and O% field failures! The focus is on design, production and reliability of electronic assemblies with particular emphasis on new components and assembly technologies. Henkel will present latest innovations to improve reliability.

We are happy to announce this year’s event. This year is proving to be bigger and better than ever before. In addition to our series of informative educational presentations and displays, this year we have 2 Key activities!! We will be hosting the IPC NE regional solder Skills competition.

Packaging Solutions for the New Technologies - Garden Hall, Messe Dresden, Germany. The Advanced Packaging conference will give the opportunity to learn more about most important microelectronics applications developments which enable novel, advanced packaging solutions to be the key drivers in system integration of electronic devices. On October 9, Henkel will present a joint paper with Magneti Marelli: “The Use of Pressureless Silver Sintering for High Reliability Power Modules in Automotive Applications” as well as a paper on Henkel’s groundbreaking new die attach technology: “Development of Novel Conductive Adhesive Films for Die Attach to Enable Improvements in Semiconductor Packaging”.

Join your industry colleagues from around the globe this October for SMTA International, the electronics assembly industry's best technical conference. Last year we welcomed over 1000 attendees from 25 different countries.

Join your military, academic and industry colleagues at the MILCOM 2012 conference in Orlando, Florida. All general sessions, panel discussions, tutorials, technical sessions, special events and industry exhibits will be held under one roof at the Gaylord Palms Convention Center near Walt Disney World.

The exhibition will bring together all the visitors and exhibitors from the FPD manufacturers industry. It is also an excellent opportunity to access the latest information about parts, materials, manufacturing and inspection equipment, as well as panel modules and application products.

35th International Electronics Manufacturing Technology Conference
6th November - 8th Nov, 2012 at Kinta River Front Hotel, Ipoh, Perak, Malaysia

The 2013 electronicAmericas event will take place from April 1 - 5 in Sao Paulo, Brazil.
 
Event Website

The SMT Hybrid Packaging expo will take place in Nuremberg from April 16 - 18, 2013.

This widely respected exhibition is a vibrant showcase for all brands from across the SMT world. It is also where the leaders in brand building, lead generation and networking for global SMT equipment and products suppliers gather.

If you missed the Webinar on March 5, 2013,  here is your chance to view it now!  Enter your Company e-mail address to view the presentation. 

The 5th i-tronik workshop is supported by Henkel Electronics and will be held in Padua, Italy on March 20-21, 2013 . At this event, Electronics Manufacturers meet end-users to dicuss latest technologies.  

From 10th to 12th of April, at the "Krokus Expo" exhibition centre in Moscow, Russia and Eastern Europe-wide largest international forum about electronics industries, "Expoelectronica" will take place.

Design solutions for LED lighting & low pressure molding manufacturers.