Photonics Materials

Photonics Materials

Henkel offers an impressive variety of products that can be used in the assembly of fiber optic components. They are suitable for many applications, among them fiber pig tailing, fiber termination, and fiber bonding. Applications include active alignment of transceiver packages, WDM component assembly, integrated optics, lens mounting and many more.

These Henkel products are cured using UV, visible light, heat cure or a combination of these methods, depending on package requirements. Developed to be low out-gassing, low warpage, high shear strength, low ionics and auto dispensable, these products are unmatched and are reliable choices for all manufacturers.


Image Sensor (CMOS/CCD) & Camera Module Assembly

Thermal Cure UV Cure UV/Thermal Cure
Thermal Cure UV Cure UV/Thermal Cure