With the QFN, the leads are located underneath the device as opposed to protruding from the sides. The QFN package also includes an exposed thermal pad, which enhances the ability of this package to remove heat from the IC. As this package is designed to manage heat dissipation, the Die Attach materials employed will most likely be thermally conductive.

Though they share similar names, the Quad Flat No-Lead (QFN) package differs from the QFP in its lead structure.

Die Attach Adhesives Molding Compounds