Ease of use is one of the top aforementioned qualities that Henkel’s Hysol brand encapsulation materials strive to provide. These products also ensure in-process simplicity and outstanding long-term performance, along with protection from the effects of mechanical damage and corrosion for Gold (Au) wire, Aluminum (Al), Silicon (Si) die and low-Potassium (K) die.
Hysol’s high purity liquid epoxy encapsulants work together as dam-and-fill materials for bare chip encapsulation, providing the ultimate in chip protection. Developed to deliver outstanding performance within high temperature, Pb-free environments, Hysol liquid Encapsulants are formulated and tested in-process and in the context of full package assembly. Henkel also has green Encapsulant materials that have been engineered to meet the needs of demanding applications for the environmentally aware manufacturer.
|Package Level||Discretes, Fill Materials|