Semiconductor Molding Compounds

Semiconductor Molding Compounds

Henkel’s Hysol brand Molding Compounds deliver the outstanding performance and ease of use that is expected from a world leader in materials technology. By combining low stress and low moisture absorption with high physical strength, all of Henkel’s molding Compounds ensure an optimized process at high yields.

These products also offer fast cycle times, a robust process window, the ability to run in excess of 700 cycles prior to mold cleaning, low dielectric properties at high temperatures, and excellent thermal characteristics. Of course, like many other products offered by Henkel, many of our Hysol Molding Compounds are green materials. They are halide-free and Pb-free compatible while also meeting RoHS requirements.


Through-Hole Discrete Surface Mount / Lead Frame Surface Mount / Laminate
Through-Hole Discrete Surface Mount / Lead Frame Surface Mount / Laminate

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