Underfills

The package-level Underfill systems have been engineered to deliver robust performance. These systems are also able to meet stringent JEDEC testing requirements and ensure Pb-free compatibility. Everything from low Potassium/Copper (K/Cu) die, materials with incredibly long working lives, Snapcure processing alternatives and both fluxing no-flow Underfills and high thermal Underfills are available through Henkel’s line of Underfill products.