Underfills

Underfills

The package-level Underfill systems have been engineered to deliver robust performance. These systems are also able to meet stringent JEDEC testing requirements and ensure Pb-free compatibility. Everything from low Potassium/Copper (K/Cu) die, materials with incredibly long working lives, Snapcure processing alternatives and both fluxing no-flow Underfills and high thermal Underfills are available through Henkel’s line of Underfill products.


Henkel’s portfolio of Underfill materials and products is continually growing, offering next generation systems with impressive designs and mechanical characteristics.

Capillaries No Flow for Small Die Applications
Capillaries No Flow for Small Die Applications