Wireless DataCom Infrastructure

With our unique RF grounding adhesives, available in both film and paste formats, we have earned a leading position in the assembly of base station electronics, as well as point-to-point and point-to-multipoint radiolink devices, satellite electronics, wireless home/office equipment and fiber optics. Our unique product line meets emerging market demands for improved RF performance in next-generation wireless telecommunications equipment, as well as increased thermal dissipation requirements for achieving longer distance communication capabilities.