Henkel today announced the commercialization of its latest semiconductor-grade capillary underfill (CUF) formulation for advanced packaging applications. The material, Loctite Eccobond UF 9000AG, enables advanced silicon (Si) node flip chip integration by providing robust interconnect protection and compatibility with high-volume manufacturing environments. While the company has well-established pre-applied paste and film underfill materials for leading-edge chip technologies, this development broadens Henkel’s post-applied capillary portfolio for flip chips with advanced node scaling.