May 13, 2014 Düsseldorf / Germany
Integrated Adhesive Solution For Enhanced Process Efficiency
Appearing from May 8 to May 14 at the Düsseldorf trade fair “Interpack,” Henkel is presenting its innovative adhesive solutions and technologies to representatives of the packaging community. Specifically, the company is showcasing the FreedomTM system solution developed together with Nordson Corporation, the leading manufacturer of precision dispensers and applicators for the world’s packaging industry.
Whether books, cellphones or beverage cans, all products need to be safely and securely packed to protect them during their often long journey to the consumer. And together with Nordson Corporation, Henkel is making a major contribution to ensuring the associated paperboard package is both reliable and economical. Since the beginning of 2013, the jointly developed system solution has been enabling packaging manufacturers serving a broad range of sectors to heat and apply only the amounts of hotmelt adhesive actually required for each seal and seam of their packaging. FreedomTM is the first fully enclosed, tankless system to be made available for the end-of-line packaging market. The Technomelt brand of hotmelts specifically developed by Henkel are the only adhesives certified for use with the FreedomTM system.
Thanks to its compact design and short hotmelt feed distances, the FreedomTM precision dispenser can be located immediately adjacent to the packaging line where it consumes some 30 percent less energy than conventional facilities. The accuracy of the application process avoids char, surplus and thus environmentally harmful waste and also reduces costly packaging line outage for greater production efficiency.
Visitors to Stand C10 in Hall 7 will be able to discuss this and other innovations from Henkel with the company’s team of experts manning the Henkel booth.