Oct 6, 2025 Düsseldorf / Germany
Henkel showcases next-generation electronics solutions with focus on electromagnetic interference (EMI) shielding, thermal management, debonding and pad printing
Henkel will present a broad portfolio of innovations for electronics assembly and printed circuit boards (PCB) protection at Productronica 2025, the world’s leading trade fair for electronics development and manufacturing, taking place November 18–21 at Messe München, Germany. Building on its strong track record as a trusted partner to the electronics industry, Henkel will highlight advanced solutions across automotive, industrial power, telecom, and printed electronics – with sustainability and reliability at the core.
At booth 321 in Hall B3, Henkel will launch its new electromagnetic interference (EMI) shielding film, a cost- and process-efficient alternative to metal housings that delivers superior EMI noise management for increasingly complex automotive electronics. Henkel will also showcase its debonding-on-demand technologies, enabling safe and non-destructive disassembly to support circularity, and next-generation thermal gap fillers optimized for high-performance automotive components.
“The automotive industry is undergoing rapid transformation, demanding new levels of performance and serviceability,” said Bart Van Eeghem, Business Development Manager, Automotive Electronics. “With our new effective and efficient EMI shielding film, debonding solutions and thermal management portfolio, Henkel is delivering technologies that meet these challenges head-on.”
Digital engineering and test capabilities
Henkel is complementing its materials portfolio with advanced engineering infrastructure that accelerates innovation. From Battery Engineering Centers to EMI test facilities, Henkel provides customers with state-of-the-art testing environments for faster validation. By leveraging simulation and modeling tools, Henkel enables digital material validation, supports the development of digital twins, and speeds up product design cycles – helping customers bring next-generation electronics to market faster.
Multi-sectoral solutions that set new standards
Beyond automotive, Henkel will showcase solutions driving reliability in other markets. In industrial power, Henkel will present the award-winning conformal coating Loctite Stycast CC 8555, which protects PCBs from moisture and chemicals, alongside the latest UL-certified potting innovation, Loctite Stycast US 8000AB – engineered for high thermal stability and superior protection in harsh environments.
In the data and telecom sector, Henkel will highlight its versatile portfolio of Thermal Interface Materials, covering various bondline thicknesses. This includes the newest generations of high-performing liquid 1K pre-cured gels, 2K curable gap fillers, and phase change materials designed to meet diverse application needs. For aviation, Henkel will feature high-reliability electronic and thermal material solutions, demonstrated in the radar module demo area.
“We are proud to deliver solutions that support the long-term performance and reliability of advanced systems in power and automation,” said Mahmoud Awwad, Business Development Manager, Power and Industrial Automation. “From data and telecom, transport, to industrial power, they will support countless advanced applications.”
Putting the spotlight on pad printing
Henkel will also highlight pad printing as a scalable manufacturing technology for functionalizing 3D parts. On November 20 (Hall B2, 2:25 – 3:05 pm), Anna Ryzhova, Business Development Manager for Printed Antenna Applications, will present ‘Functionalizing 3D Parts with Precision: Pad Printing as a Scalable Alternative Manufacturing Technology’.
“Printed electronics is an integral part of the electronics world with high innovation speed, and each year it enables new applications providing more sustainable and cost-effective solutions,” said Ryzhova. “The market need for functionalization, miniaturization and easy integration in 3D-shaped parts paves the way for emerging technologies such as pad printing of conductive materials. We will highlight why pad printing could be the technology of choice for your next challenge.”
Shaping the future of electronics
With advanced materials, digital engineering capabilities, and global infrastructure, Henkel is accelerating innovation in electronics – empowering safer, smarter, and more reliable and sustainable technologies.
Henkel showcases next-generation electronic solutions for different industry segments at Productronica.
