Oct 28, 2025
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Press Release
Henkel unveils high thermal conductivity gap filler for AI data center optical transceivers
Tackling the thermal control demands of cutting-edge AI data center optical components, Henkel today announced the commercialization of Loctite TCF 14001, a high thermal conductivity silicone liquid thermal interface material (TIM). Designed for 800G and 1.6T transceiver technologies, the 14.5 W/m-K gap filler is among the highest thermally conductive liquid materials on the market, enabling elevated transceiver performance through robust heat management.
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