Technomelt materials are recognized for their fast, gentle, low-energy processing capabilities and lower standard emissions compared to conventional potting encapsulants. Potting materials may require as many as eight steps and up to 24 hours to process. In comparison, Technomelt hot melts encapsulate electronic parts in three simple steps with minimal pressure and cycle times as low as 30 seconds. Until now, achieving small dimension filling while maintaining the proven protective characteristics of Technomelt materials has been challenging. Technomelt PA 6370 has resolved this with an ultra-low melt viscosity (2700 – 3000 mPa·s @ 210° C; 1065-1180 mPa·s at 240° C) that delivers good penetration and wetting along with high adhesion stability on multiple substrates, passing lap shear testing after 1,200 hours exposure to high heat and moisture (85°C/85° RH).
May 26, 2026 Düsseldorf / Germany
Henkel ultra-low viscosity Technomelt material delivers rugged protection for challenging electronic device designs
Expanding its award-winning line of Technomelt low pressure molding materials, Henkel today announced the addition of Technomelt PA 6370, a highly flowable, ultra-low melt viscosity formulation engineered for the most intricate and challenging electronic systems and components. Capable of thoroughly filling gaps as small as 0.5mm, the new polyamide-based hot melt meets rigorous industry requirements to ensure rugged moisture, heat, corrosion, and environmental resistance, elevating operational reliability.
“Achieving void-free small gap filling while maintaining material adhesion strength after exposure to water, salt fog, humidity, and temperature ageing is a formidable task,” says Henkel Senior Business Development Manager, Justin Kolbe. “That’s why Technomelt PA 6370 is such an important achievement for electronics protection requirements. It delivers extreme manufacturing flexibility, high throughput, UL flame retardancy compliance, and high environmental resistance for assemblies with small gaps exposed to continuous use in harsh outdoor conditions.”
Technomelt PA 6370 has excellent electrical insulation properties and meets the UL 94 V-0 flame retardancy standard. The material’s low coefficient of thermal expansion (CTE) of 175 ppm is also notable, rivaling that of many two-part polyurethane and epoxy potting formulas. This characteristic confirms Technomelt PA 6370’s dimensional stability and stress-resistance across its wide operating temperature range of -20° C to 140° C.
In Kolbe’s view, Technomelt PA 6370 dramatically expands manufacturers’ protection options. “With this innovation, many tradeoffs are eliminated,” he concludes. “You can have production speed, intricate part penetration, and excellent device fortification. Technomelt PA 6370 closes the gap.”
Technomelt PA 6370 is well-suited for low-voltage applications such as motors, as well as connectors, sensors, printed circuit boards, and any electronic device operating in harsh, demanding conditions. Learn more about Technomelt PA 6370 or request a sample here.
With Technomelt PA 6370 Henkel has launched a new low pressure molding hot melt for challenging electronic device designs.
Technomelt PA 6370 offers a fast, cost-effective alternative to potting, enabling small gap filling and reliable, long-term environmental resistance.
