Jul 21, 2026 Düsseldorf / Germany

Bergquist Gap Filler TGF 6500LVO extends the range to meet critical thermal management demands in automotive electronics

Henkel launches next-generation thermal gap filler with 6.5W/m∙K conductivity

Rising thermal loads in vehicle electronics are increasing the need for high-performance thermal management solutions, especially in advanced applications such as ADAS, ECUs, or power conversion components in electric vehicles. To address this fast-evolving challenge, Henkel Adhesive Technologies has launched Bergquist Gap Filler TGF 6500LVO, a next-generation thermal gap filler with 6.5W/m∙K thermal conductivity. This new material enables more effective heat transfer in critical systems, helping manufacturers manage increasing power density and maintain performance and reliability.

Pillars of performance: conductivity, flexibility and reliability

Bergquist Gap Filler TGF 6500LVO is a 2-component thermal gap filler based on low-volatile silicone technology. Designed to reduce thermal resistance and improve efficiency in compact systems, the material combines high thermal conductivity with a low bond line thickness, enabling greater design flexibility for space-constrained applications while maintaining thermal performance.

The material delivers reliable performance at operating temperatures up to 150°C, as well as in siloxane-sensitive applications that require minimal fogging or outgassing. With fast, robust dispensing characteristics, Bergquist Gap Filler TGF 6500LVO is suited to automated production lines and high-throughput manufacturing. It can be cured at room temperature or via heat-accelerated processes, supporting flexible and efficient production.

Next-generation series evolves in line with customer needs

Bergquist Gap Filler TGF 6500LVO joins Bergquist Gap Filler TGF 2100LVO, Bergquist Gap Filler TGF 2900LVO, Bergquist Gap Filler TGF 4400LVO and Bergquist Gap Filler TGF 10000 in a product portfolio that enables customers to select materials that match their required thermal performance.

“Our next-generation thermal gap fillers enable OEMs and component manufacturers to balance the increasingly complex requirements of automotive electronics, including thermal management, sustainability, and streamlined production cycles,” says Nancy Yang, Business Development Manager Automotive Electronics at Henkel. “Bergquist Gap Filler TGF 6500LVO is exceptionally thermally conductive, and high-performing. It adds a new dimension to the range, giving customers even more possibilities for addressing rising thermal loads and keeping one step ahead of their challenges.”