Dec 10, 2025
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Press Release
Henkel’s answer to ultra-demanding electronics applications: the Bergquist TGF 10000 thermal gap filler
Henkel continues to drive innovation in thermal interface materials with the introduction of Bergquist TGF 10000, an advanced liquid gap filler that delivers 10 W/mK thermal conductivity. Designed for high-power applications where reliable heat dissipation is critical, Bergquist TGF 10000 sets a new benchmark for performance and versatility across sectors including automotive, telecommunications, computing, consumer electronics, and network infrastructure.
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