What makes you a good fit
- Master or PhD degree in polymer materials science and engineering, applied chemistry, materials science, adhesive science.
- Proficient in the synthesis, modification, and curing mechanisms of resin systems such as epoxy and acrylic resins (heat curing, UV curing, moisture curing).
- Deep understanding of the effect of inorganic fillers on the key properties of underfill materials. Proficient in applying rheological principles to regulate the properties of base fillers.
- Proficient in material characterization using DSC, TGA, DMA, TMA, rheometers, infrared spectroscopy, SEM, etc.
- 5+ working experiences in product development and performances evaluation of electronic packaging materials, especially underfill adhesives, epoxy molding compound and chip bonding adhesives (candidate with the experience in successfully leading projects from laboratory formulation to mass production at the customer site would be preferred).
- Capable of managing R&D project milestones and communicating effectively with customers, sales, AE, production, etc. to translate customer requirements into technical language.
- Deep understanding of cost control, product consistency and reliability, with sensitivity to downstream industry trends (e.g., advanced packaging, chiplet technology).
- Good English communication skill in listening, speaking and writing.
- Quick learner, open-minded and good communication skills.
Some perks of joining Henkel
At Henkel, we come from a broad range of backgrounds, perspectives, and life experiences. We believe the uniqueness of all our employees is the power in us. Become part of the team and bring your uniqueness to us! We welcome all applications across different genders, origins, cultures, religions, sexual orientations, disabilities, and generations.
JOB ID:
26090502
Job Locations:
China, Guangdong, Dongguan
Contact information for application-related questions:
Henkel.GCN.Recruitment@henkel.com
Please do not use this email address for sending your application or CV. To apply, please click on the "Apply for this role" button below. Applications sent via e-mail will not be accepted.
Application Deadline:
As long as the vacancy is listed on our Career Site, we are happy to receive your application
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