“The miniaturization trend is now firmly part of the automotive and aerospace sectors, particularly for advanced driver assistance system (ADAS) technologies such as cameras, radars and lidars; as well as aerospace, satellite and UAV applications,” says Henkel Global Market Segment Head for ADAS and Safety, Vinod Partha. “The use of fine-pitch array devices such as BGAs and CSPs within these systems has increased dramatically, making interconnect protection a critical component for long-term reliability and performance. Loctite Eccobond UF 1173 provides this essential protection in a formulation that can withstand the high operating temperatures induced by smaller, higher functioning devices within challenging operating conditions.”
Dec 10, 2018 Irvine / USA
High operating temperature underfill for electronics protection in Aero and Auto
Anticipating the requirements for next-generation high-reliability electronics applications, Henkel has developed Loctite Eccobond UF 1173. The protective underfill material, which has been formulated with health and safety top-of-mind, does not contain any reportable REACH SVHCs*, is not CMR classified and delivers outstanding performance under high operating temperature environments.
Henkel’s new underfill system improves on older-generation materials, not only with its prioritization of health and safety, but also from a performance and processing perspective. Loctite Eccobond UF 1173 is a one-component underfill that can be jet or needle dispensed, flows fast in and around tight interspaces and cures quickly to form void-free interconnect protection from shock, drop and vibration. Importantly, the novel underfill exhibits high glass transition (Tg) temperature capability of 155°C and a low coefficient of thermal expansion (CTE) to ensure robust protection performance even under stressful conditions.
“Proper function of ADAS automotive systems and aerospace technologies is not a matter of convenience; reliable operation is integral to fail-safe performance,” explains Doug Katze, Henkel Global Market Segment Manager, Aerospace. “If a solder joint on a BGA cracks due to stress, failure of the component and the system’s function are the potential result. Loctite Eccobond UF 1173 protects devices from stress-related failures, while complying with current health standards and offering the ability to cope with operating temperatures as high as 155°C. This material is a boon for system reliability when harsh environments are the norm.”
For more information about Loctite Eccobond UF 1173 or any of the company’s electronic protection materials, visit www.henkel-adhesives.com/electronics.
* As per current, June 2018 REACH SVHC documentation.